Open (posted) · Cooperative Agreement
CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment
National Institute of Standards and Technology, Department of Commerce
Key facts
Copied from the official Grants.gov record. Last verified October 29, 2026.
- Program name
- CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment
- Issuing agency
- National Institute of Standards and Technology (Department of Commerce)
- Opportunity number
- 2023-NIST-CHIPS-SMME-01
- Funding type
- Cooperative Agreement
- Funding purpose
- Science and Technology and other Research and Development
- Status
- Open (posted)
- Application deadline
- Closes November 1, 2026(3 days left)
- Published award range
- Not published by the agency
- Cost sharing or match required
- No
- Eligible applicants (official categories)
- Others (see Additional Information on Eligibility)
- Relevant to
- NonprofitsHow we determined this: Listed as 'Others'; the agency's eligibility text mentions nonprofits (flagged for review).
- Geographic restrictions
- None stated in structured data (federal opportunities are often nationwide). Check the eligibility details and full announcement for any limits.
- Assistance Listing (CFDA)
- 11.037
- Official source
- View on Grants.gov ↗ · Agency information link ↗
- Application URL
- www.grants.gov/search-results-detail/350338 ↗Apply through Grants.gov (Workspace) using the application package on the official listing, unless the full announcement names a different submission system.
- Source identifier
- Grants.gov opportunity ID 350338 · Funding opportunity number 2023-NIST-CHIPS-SMME-01
- Posted
- September 29, 2023 · Source last updated October 16, 2025
- Last verified
- October 29, 2026 (against Grants.gov)
- Data completeness
- 92% of key fields published by the sourceNot published: published funding range.
- Record confidence
- loweligibility described only in free text (in review).
Eligibility details (from the agency)
An applicant must be a “covered entity” to receive CHIPS Incentives. For purposes of this NOFO, a “covered entity” means a nonprofit entity; a private-sector entity; a consortium of private-sector entities; or a consortium of nonprofit, public, and private-sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors or semiconductor manufacturing equipment.
Description (from the official listing)
The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the second Notice of Funding Opportunity under this program and seeks applications for projects for the construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment. For more information, additional resources, and instructions on how to apply, please visit chips.gov. Note that all applications must be submitted through the CHIPS Incentives Portal at https://applications.chips.gov. If you have any questions on how to apply, please email apply@chips.gov.
Agency contact
Misty Roosa
Management Analyst
apply@chips.gov